#We are hiring #IC PACKAGE DESIGN ENGINEER
BANGALORE/CHENNAI
interested candidates please drop your resume to suganya.c@hcl.com
JD:• IC Package layout design including feasibility studies, substrate layout design/routing, DRC, package stack up, ball map etc.
• Design and development of electronics packages adhering to the thermal/mechanical/electrical aspects.
• Responds to customer and/client requests or events as they occur.
Qualifications:
You should possess a Bachelors Degree in Electronics Engineering or relevant disciplines with 4 years experience in the related field.
Requirements
• Experience and/or exposure with physical layout design (Package or PCB)
• Fluent in IC package layout design tools - Mentor Graphics Xpedition PCB
• Must understand various interface requirement like USB/DDR/PCIe etc.
• Good understanding of transmission line effect, crosstalk, frequency domain analysis, termination techniques, signal return path etc
BANGALORE/CHENNAI
interested candidates please drop your resume to suganya.c@hcl.com
JD:• IC Package layout design including feasibility studies, substrate layout design/routing, DRC, package stack up, ball map etc.
• Design and development of electronics packages adhering to the thermal/mechanical/electrical aspects.
• Responds to customer and/client requests or events as they occur.
Qualifications:
You should possess a Bachelors Degree in Electronics Engineering or relevant disciplines with 4 years experience in the related field.
Requirements
• Experience and/or exposure with physical layout design (Package or PCB)
• Fluent in IC package layout design tools - Mentor Graphics Xpedition PCB
• Must understand various interface requirement like USB/DDR/PCIe etc.
• Good understanding of transmission line effect, crosstalk, frequency domain analysis, termination techniques, signal return path etc